Interface Engineering of Perovskite Hybrid Solar Cells with Solution-Processed Perylene-Diimide Heterojunctions toward High Performance

Min, Jie; Zhang, ZhiGuo; Hou, Yi; Quiroz, COR; Przybilla, T; Bronnbauer, C; Guo, Fei; Forberich, K; Azimi, H; Ameri, T; Spiecker, E; Li, Y; Brabec, CJ

HERO ID

3125180

Reference Type

Journal Article

Year

2015

HERO ID 3125180
In Press No
Year 2015
Title Interface Engineering of Perovskite Hybrid Solar Cells with Solution-Processed Perylene-Diimide Heterojunctions toward High Performance
Authors Min, Jie; Zhang, ZhiGuo; Hou, Yi; Quiroz, COR; Przybilla, T; Bronnbauer, C; Guo, Fei; Forberich, K; Azimi, H; Ameri, T; Spiecker, E; Li, Y; Brabec, CJ
Journal Chemistry of Materials
Volume 27
Issue 1
Page Numbers 227-234
Abstract Perovskite hybrid solar cells (pero-HSCs) were demonstrated to be among the most promising candidates within the emerging photovoltaic materials with respect to their power conversion efficiency (PCE) and inexpensive fabrication. Further PCE enhancement mainly relies on minimizing the interface losses via interface engineering and the quality of the perovskite film. Here, we demonstrate that the PCEs of pero-HSCs are significantly increased to 14.0% by incorporation of a solution-processed perylene-diimide (PDINO) as cathode interface layer between the [6,6]-phenyl-C61 butyric acid methyl ester (PCBM) layer and the top Ag electrode. Notably, for PDINO-based devices, prominent PCEs over 13% are achieved within a wide range of the PDINO thicknesses (5-24 nm). Without the PDINO layer, the best PCE of the reference PCBM/Ag device was only 10.0%. The PCBM/PDINO/Ag devices also outperformed the PCBM/ZnO/Ag devices (11.3%) with the well-established zinc oxide (ZnO) cathode interface layer. This enhanced performance is due to the formation of a highly qualitative contact between PDINO and the top Ag electrode, leading to reduced series resistance (R-s) and enhanced shunt resistance (R-sh) values. This study opens the door for the integration of a new class of easily-accessible, solution-processed high-performance interfacial materials for pero-HSCs.
Doi 10.1021/cm5037919
Wosid WOS:000348085300030
Is Certified Translation No
Dupe Override No
Is Public Yes